| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Origin | Guangdong, China |
|---|---|
| Type | Rigid Circuit Board |
| Insulation Materials | Metal Composite Materials |
| Base Material | Copper |
| Surface Finish | HASL, Lf HASL, Imm Gold, Imm Silver, OSP Etc |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR-4/High TG FR-4/CEM-3/CEM-1 |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 1.6mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Electroless Copper/rolling Copper |
| Copper Thickness 12~50UM | 12~50UM |
| Board Thickness | 0.075~0.16MM |
| Min. Hole Size | 0.2mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Copper |
| Material | Polyester Glass Fiber Mat Laminate |
| Processing Technology | Electrolytic Foil |
| Application | Consumer Electronics |
| Origin | Guangdong, China |
|---|---|
| Base Material | Copper |
| Material | Epoxide Woven Glass Fabric Laminate |
| Structure | Multilayer Rigid PCB |
| Application | Electronics Device |
| Name | FPC |
|---|---|
| Base Material | FR-4 |
| Min. Line Width | 0.1mm(Flash Gold)/0.15mm(HASL) |
| Surface Finishing | Immersion Gold |
| Copper Thickness | 1oz |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Model Number | FLCA-G125 |
|---|---|
| Type | FPC |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
