Type | Ceramic PCB Manufacturer |
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Material | FR4 CEM1 CEM3 Hight TG |
Base Material | Copper |
Insulation Materials | Organic Resin |
Processing Technology | Electrolytic Foil |
Model Number | PCB-0261 |
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Place Of Origin | Guangdong, China |
Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
Copper Thickness | 1 - 4OZ |
Board Thickness | 0.2mm~3.0mm |
Type | Combining Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Material | Fiberglass Epoxy |
Base Material | FR4 (Tg130~Tg170) |
Insulation Materials | Epoxy Resin |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Model Number | OEM/ODM/EMS |
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Base Material | FR-4 |
Copper Thickness | 0.5-6oz |
Board Thickness | 0.2-4mm |
Min. Hole Size | 0.1mm |
Model Number | PCBA-0606 |
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Place Of Origin | Guangdong, China |
Base Material | FR4 |
Copper Thickness | 1 Oz |
Board Thickness | 1.6mm |
Type | Rigid Circuit Board |
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Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Insulation Materials | Organic Resin |
Brand | Fast PCB Technology |
Model Number | Custom PCB & PCB Assembly |
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Supplier Type | OEM |
Product Name | Mechanical Keyboard |
Capacity | Hotswap, USB Type-C, Kailh Socket, LED |
Speed | 0.15sec/chip,0.7sec/QFR |