Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
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Base Material | FR-4 |
Min. Line Spacing | 4/4mil(0.1/0.1mm) |
Board Thickness | 1.6mm-3.2mm |
Min. Line Width | 0.1mm/4mi |
Place Of Origin | Guangdong, China |
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Base Material | Aluminum |
Insulation Materials | Epoxy Resin |
Layer | 1-40 Layer |
Board Thickness | 0.2-8.0mm |
Place Of Origin | Guangdong, China |
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Supplier Type | OEM PCBA |
Copper Thickness | 0.5-6oz |
Application | Electronics Device |
Material | FR4 CEM1 CEM3 Hight TG |
Place Of Origin | Guangdong, China |
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Supplier Type | PCB Assembly Manufacturer |
Copper Thickness | 3 Oz |
Solder Mask Color | Blue.green.red.black.white |
Surface Finishing | HASL\OSP\immersion Gold |
Place Of Origin | Guangdong, China |
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Type | Multilayer PCB |
Number Of Layers | 1- 24 Layers |
Base Material | FR-4 |
Copper Thickness | 1oz |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Application | Consumer Electronics |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Type | Heavy Copper PCB |
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Place Of Origin | Guangdong, China |
Base Material | Aluminum |
Copper Thickness | 3u |
Board Thickness | 0.2mm~3.0mm |
Type | Ceramic PCB Manufacturer |
---|---|
Material | FR4 CEM1 CEM3 Hight TG |
Base Material | Copper |
Insulation Materials | Organic Resin |
Processing Technology | Electrolytic Foil |
Type | Consumer Electronics PCBA |
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Place Of Origin | Guangdong, China |
Material | Fiberglass Epoxy Resin + Polyimide Resin |
Base Material | Aluminum |
Insulation Materials | Metal Composite Materials |