| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Mechanical Rigid | Rigid |
| Insulation Materials | Metal Composite Materials |
| Processing Technology | Electrolytic Foil |
| Type | Rigid Circuit Board |
|---|---|
| Surface Finishing | HASL |
| Copper Thickness | 1oz |
| HS Code | 8534009000 |
| Test | Customer's Test Method |
| Model NO | Microcontroller |
|---|---|
| Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
| Layer | 1-40 Layer |
| Min.Hole Size | 0.1mm (4 Mil) |
| Min.Line Spacing | 0.1mm (4 Mil) |
| Color Of PCB | Green、Black 、Orange、Blue、Customized |
|---|---|
| Connector | Type C、USB、Micro USB |
| Base Material | Fr4/Customized |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Place Of Origin | Guangdong, China |
|---|---|
| Copper Thickness | 1 Oz |
| Base Material | Polyimide |
| Min. Line Width | 0.1mm |
| Board Thickness | 1.6mm |
| Layer | 2-layer |
|---|---|
| Board Thickness | 1.6mm |
| Warranty | 1 Year |
| Surface Finish | ENIG |
| Min. Line Width | 0.1mm |
| Solder Mask Color | Green |
|---|---|
| Surface Finish | ENIG |
| Warranty | 1 Year |
| Material | Flexible PCB |
| Min. Line Width | 0.1mm |
| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| FPC Layer | 1-8 Layers |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Min. Hole Size | 0.20mm |
| Model Number | GL-2165 |
|---|---|
| Type | Home Appliance Pcba |
| Copper Thickness 4 Oz | 4 Oz |
| Service | PCB Fabrication, Compoennts Sourcing, PCB Assembly |
| Testing Service | AOI , Functional Testing ,flying Probe Testing, E-testing |
| Brand Name | POE |
|---|---|
| Base Material | FR4 |
| Copper Thickness | 1oz |
| Board Thickness | 1.6mm |
| Min. Hole Size | 0.2mm |
